METHOD FOR FORMING VIA CONTACT OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for forming a via contact of a semiconductor device is provided to prevent a void in the via contact from generation and to reduce a specific resistance of the via contact and a metal line for improving an electric source transferring speed. CONSTITUTION: A method for forming a via contact by reclaiming a metal into a via contact hole formed on a semiconductor substrate comprises: tilting the semiconductor substrate toward up and down for a certain angle; tilting the semiconductor substrate toward left and right for a certain angle; and evaporating and depositing the metal in the via contact hole.