ELECTROSTATIC CHUCK FOR SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

摘要

PURPOSE: An electrostatic chuck is provided to eliminate the instability of plasma and to prevent the production of particles in the processing. CONSTITUTION: The electrostatic chuck production method for a semiconductor device having a wafer installation pad(42) protruding the same way as the wafer comprises steps of; adjusting the geometrical size of the wafer installation pad; anode treatment of the electrostatic chuck; attaching a protective ring around the wafer installation pad; forming a polyamide film on the top of the wafer installation pad.