PLASTIC DRY PLATING METHOD OF IMPROVED ADHESION BETWEEN METAL AND CERAMIC THIN FILM

摘要

PURPOSE: A method for producing a ceramic thin film with an excellent adhesion on the plastic base metal may use for shielding a harmful electromagnetic wave of various electronic and electric appliances. CONSTITUTION: In the plastic dry plating method for depositing metal and ceramic thin film on the plastic surface by using a vacuum deposition and sputtering method, an improved adhesion between metal and a ceramic thin film is attained by forming a fine unevenness on the plastic surface as follows. The fine unevenness is formed by etching the surface of plastic injection mould with a mean roughness of 1-1,000 micro meter or injecting a fine ceramic particle with a size of below 0.5mm to form the mean surface roughness of 12000-2,000 micro meter. The plastic surface is exposed to the degree of vacuum of 10¬-2-10¬-3 torr, the voltage of below 0.1 W/cm¬2, the distance between a cathode and a base metal of 10-20 mm to remove foreign material from the surface.