| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting capacitor whose mounting ratio is improved by preventing the bending of a pedestal at the time of solder reflow. SOLUTION: A metallic case 11a is fixed through adhesive 16 with a pedestal 12 at two faced parts 14a and 14b at which a line C obliquely crossing a line A connecting a pair of electrode terminals 13a and 13b is allowed to cross the outer peripheral face of the metallic case 11a. Thus, the metallic case is fixed through the adhesive to the pedestal at the two counter parts at which the line obliquely crossing the line connecting a pair of electrode terminals is allowed to cross the outer peripheral face of the metallic case so that the bending of a sealing body or the pedestal can be reduced more, and the mounting ratio can be improved more than the case that the metallic case is fixed to the pedestal at the other part.
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