| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic parts mounting method which can provide a circuit board enabling to secure long-term reliability. SOLUTION: In this method, mounting of electronic parts which mounts an electronic parts 18 on a board is performed. In this case, this method includes a process of forming a solder layer on the pad of the board, a process of flattening the solder layer, a process of forming an activator layer not including resin components in the flattened solder layer, a process of positioning an electronic part 18 where a bump 17 is made on the above board and soldering the electronic part 18 to the above solder layer, and a sealing process of making insulating resin 25 permeate between the electronic part 18 and the above board and hardening it after soldering. |
