| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which the arrangement of a board can be facilitated by enhancing the efficiency of leading out a wiring pattern formed on the board. SOLUTION: In an insertion board 10D of a semiconductor device 10 inserted between a semiconductor element 11 and a wiring board 20 and connecting the electrodes of the semiconductor element 11 with lands 21 of the wiring board 20, a plurality of insertion board lands 16 are formed in lattice at a plurality of intervals of arrangement at plural conductor parts which are jointed to the plurality of lands 21 of the wiring board 20 thus forming a plurality of wiring patterns L13, as required, between the insertion board lands 16. A plurality of wiring patterns can also be formed, as required, between the lands 21A of the wiring board 20. |
