| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for applying a resist, with which even a small amount of resist liquid can be discharged continuously for a long time and high in-plane film thickness accuracy can be provided. SOLUTION: When a face, including the surface of a semiconductor wafer 15, is defined as α and a face through almost the center of the wafer and being almost vertical to the face α is defined as β, in the state of inclining the main axis of a dispenser in liquid discharging direction along with the face and keeping an acute angle θ formed by the main axis and the face α within the range of from 5 to 85 deg., while moving the dispenser from wafer inner peripheral side to the outer peripheral side along with almost the crossing line of the faces αand β, the resist liquid is discharged toward the rotating wafer and on that wafer, the resist film of the desired thickness is formed. |
