JUNCTION MATERIAL SUPPLY METHOD OF DIE BONDER AND ITS DEVICE

摘要

PROBLEM TO BE SOLVED: To accurately apply a large quantity of junction material to a desired region of a work. SOLUTION: A junction material supply device 4 of a die bonder 1 for supplying a junction material B to a die junction part on a work A for joining a die C has a single junction material supply nozzle 23 which supplies the junction material B, a moving means 26 which holds the junction material supply nozzle 23 and moves the junction material supply nozzle 23 to the work A in an X-axis direction and in a Y-axis direction relatively, and a control means 6 which controls the junction material supply nozzle 23 and the moving means 26. The control means 6 supplies the junction material B to a die junction part while moving the junction material supply nozzle 23 in an X-axis direction and a Y-axis direction relatively.