| 摘要 |
PROBLEM TO BE SOLVED: To increase bonding strength of bonding and reduce a manufacturing cost, in wire bonding. SOLUTION: This wire bonding equipment is provided with a capillary 3 where a wire guide hole 3c is formed in the inside, and a trench part 3b is formed in the tip surface 3a which presses a wire bonding part of a wire at the time of bonding, an US horn applying ultrasonic vibration to the capillary 3, and a bonding treatment part where wire bonding is performed by the capillary 3. When wire bonding is performed by pressing the wire bonding part with the capillary 3, contact resistance between the capillary 3 and the wire bonding part is increased with the trench part 3b formed in the tip surface 3a of the capillary 3, and pressing of the wire bonding part is performed. |
