发明名称 SIMPLIFIED PROCESS FOR PRODUCING NANOPOROUS SILICA
摘要 <p>The present invention relates to low dielectric constant nanoporous silica films and to processes for their manufacture. A substrate, e.g., a wafer suitable for the production of an integrated circuit, having a plurality of raised lines and/or electronic elements present on its surface, is provided with a relatively high porosity, low dielectric constant, silicon-containing polymer film composition.</p>
申请公布号 WO0002233(A2) 申请公布日期 2000.01.13
申请号 WO1999US15345 申请日期 1999.07.07
申请人 ALLIEDSIGNAL INC. 发明人 WALLACE, STEPHEN;RODERICK, KEVIN, H.;RAMOS, TERESA;BRUNGARDT, LISA, BETH;SMITH, DOUGLAS, M.;DRAGE, JAMES;WU, HUI-JUNG;VIERNES, NEIL
分类号 H01L21/3105;H01L21/312;H01L21/316;(IPC1-7):H01L/ 主分类号 H01L21/3105
代理机构 代理人
主权项
地址
您可能感兴趣的专利