| 摘要 |
PROBLEM TO BE SOLVED: To make the shape of the chamfer section of a wafer accurately coincident with the shape of the groove of a buff by grinding to the outer periphery section of the wafer with a grinding wheel, then polishing with the buff. SOLUTION: A grinding wheel is called out from a storage magazine 8 by an automatic tool changing means and is fitted to a main spindle 3. The tip of a cutting tool 10 fixed on an X-Y table 7 is ground by the groove of the grinding wheel rotatively held by the main spindle 3. The tool of the main spindle 3 is replaced from the grinding wheel to a buff by the automatic tool changing means. When the buff is set to the main spindle 3, the buff is cut by the cutting tool 10 ground with its tip for the groove machining of the buff. The groove shape of the grinding wheel can be transferred to the buff via the cutting tool 10, thus the groove shape of the grinding wheel is prevented from being made inconsistent with the groove shape of the buff, thereby the outer periphery section of a wafer 2 can be chamfered very accurately.
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