| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition with high heat resistance, low dielectric dissipation factor and excellent adhesion by compounding a combination of an epoxy compound having at least two epoxy groups in a molecule and a one kind of a polyfunctional epoxy compound, a phenol modified polyphenylene ether, a cyanate compound and a curing accelerator as essential components. SOLUTION: An epoxy compound having at least two epoxy groups in a molecule is not particularly limited. An epoxy compound which is combined is selected from compounds represented by formula I (wherein R1 and R2 are each H, or R1 is Me and R2 is tBu), formulas II and III. A modified polyphenylene ether is prepared by re-distribution reacting a polyphenylene ether with a phenol in the presence of a radical initiator. A cyanate compound is an aromatic compound having at least two cyanate groups in a molecule. As a curing accelerator, a metal salt of octenoic acid and Zn, or the like is employed. An insulated-substrate is obtained by impregnating a glass base material with an epoxy resin composition and curing the resultant product.
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