发明名称 DRESSING METHOD FOR POLISHING CLOTH
摘要 PROBLEM TO BE SOLVED: To provide a dressing method to indicate uniform wear amount distribution in a surface during dressing of the polishing cloth of a chemical mechanical polishing. SOLUTION: At an xy orthogonal coordinate generated when the center of a platen forms an origin, and the oscillation starting position of a dresser forms a point C. A polishing platen is rotated at a first rotation speed and the dresser at a second rotation speed. When, for example, two numerals are 61 and 13, a least common denominator is 793. Further, the dresser is caused to effect an oscillation motion by a simple harmonic motion within a range extending from the center of a polishing platen to the outer periphery thereof. An oscillation starting position is caused to coincide with an oscillation central position. Concretely, a simple harmonic motion in the direction of an Y-axis is effected centering around a point C serving as an oscillation center. Under a dressing condition described above, one diamond on the dresser realizes an even contact state in many regions on polishing cloth. Namely, uniform dressing is applied on the interior of the surface of the polishing cloth.
申请公布号 JP2000000761(A) 申请公布日期 2000.01.07
申请号 JP19980166614 申请日期 1998.06.15
申请人 MATSUSHITA ELECTRON CORP 发明人 YOSHIDA HIDEAKI
分类号 B24B53/017;B24B53/02;B24B53/053;F16L21/02;H01L21/304 主分类号 B24B53/017
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