| 摘要 |
PROBLEM TO BE SOLVED: To efficiently prevent the particles from adhering to a substrate. SOLUTION: In a semiconductor manufacturing device processing a substrate 3000 by impressing a gas with voltage for making the gas plasmatic, the particles positively charged in a processing chamber 2100 are trapped or induced by an electrode 15, a grid 13 and a cover 3600, etc., supplied with a negative a potential as soon as a cathode voltage supply is stopped so as to prevent the particles from arriving at the substrate 3000.
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