| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition having good repletion and workability in transfer molding, little in wear of an equipment in the molding process and smaller internal stress in electric parts by compounding silica filler with a thermosetting resin and to provide a semiconductor device. SOLUTION: This resin composition comprises 100 pts.wt. thermosetting resin and 100-2,000 pts.wt. silica filler, and this semiconductor device is produced by sealing the semiconductor chip with the cured product of the sealing resin composition in which the thermosetting resin is an epoxy resin. The silica filler is silica pulverized powder prepared by grinding particles among one another in an aqueous medium while pressing crushed silica from outside to round the rough edges of silica particle, has 200-300μm maximum particle diameter and 7-35μm average particle diameter, and contains >=12 wt.% pulverized silica having <=3μm particle diameter and >=2 wt.% pulverized silica having <=1μm particle diameter.
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