发明名称 PANEL FOR FLOOR HEATING
摘要 PROBLEM TO BE SOLVED: To improve adhesion between a panel for floor heating and a floor joist without increasing a manufacturing cost of the panel for floor heating. SOLUTION: A panel 20 for floor heating is disposed between floor joints of which a building floor consists, and dissipates heat onto a floor surface. This panel comprises a heating fluid conducting pipe 25 to guide heating fluid; a panel body 23 provided on the back with the heating fluid conducting pipe, and at two side edges with flange parts 29 locked on the upper surface of the floor joist; and a heat insulation material 27 which is fixed on the back of the panel body, and in which the heating fluid conducting pipe is embedded. Overhang parts 39 are integrally formed on the surface, by making contact with a floor joint 22, of a heat insulation material 27.
申请公布号 JP2000002443(A) 申请公布日期 2000.01.07
申请号 JP19980168548 申请日期 1998.06.16
申请人 SANYO ELECTRIC CO LTD 发明人 SHIKICHI CHIAKI;KATO HARUO;YANAGIDA SHINICHIRO;FUJIO HIROMI;KADOMA NORIFUMI
分类号 F24D3/16;(IPC1-7):F24D3/16 主分类号 F24D3/16
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