| 摘要 |
<p>The invention relates to a device for cleaning components (1) coming into contact with liquefied plastic which adheres to said components, using a liquid solvent e.g. triethylene glycol (TEG), which is contained in a cleaning receptacle (2) and heated to a cleaning temperature whereby said components are rinsed therewith. The cleaning receptacle is connected to a heating receptacle (4) by means of a circuit (5, 5', 5") containing a pump (6). The cleaning fluid is heated for several hours in said receptacle for several hours to reach a cleaning temperature the heating receptacle is connected to a boiler receptacle followed by a condensation receptacle (14) via a distillation circuit (12, 12', 12'', 12''') which contains a pump (5) whereby the distilled cleaning fluid is fed to the heating receptacle.</p> |
