发明名称 APPARATUS FOR TESTING HIGH-SPEED ELECTROPLATING INTERNAL STRESS
摘要 PROBLEM TO BE SOLVED: To measure by a compact and relatively simple testing apparatus by providing the apparatus with cathode metallic plates of thin sheets at predetermined points of a cathode metallic rod held rotatably. SOLUTION: A testing apparatus A for measuring a plating internal stress generated at the time of high-speed electroplating has a cylindrical cathode metallic rod 3, e.g. at a position opposite to an anode metallic plate 2 in a water tank 1. The cathode metallic rod can be rotated by a motor 4. Cathode metallic plates 5 of thin sheets are fitted at both faces of a predetermined points of the metallic rod 3. A plating liquid 14 is filled in the water tank 1, and the testing apparatus A is driven for a predetermined time after a revolution number of the motor 4 and a voltage, a current of a rectifier 6 are adjusted. The cathode metallic plates 5 plated only at one face is separated and an internal stress is measured with the use of a strip type stress meter, etc. The water tank 1 is shaped in a rectangular box or circular cylinder, and the predetermined anode metallic plate is arranged to conform to the shape of the water tank and a position of the cathode.
申请公布号 JP2000002598(A) 申请公布日期 2000.01.07
申请号 JP19980166909 申请日期 1998.06.15
申请人 YAMAMOTO MEKKI SHIKENKI:KK 发明人 YAMAMOTO WATARU
分类号 G01L1/00;C25D17/00;C25D21/12;(IPC1-7):G01L1/00 主分类号 G01L1/00
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