| 摘要 |
PROBLEM TO BE SOLVED: To obtain a phenol resin compsn. exhibiting a low thermal conductivity at high temps. by compounding a phenol resin with a powdery cured phenol resin having a specified average particle size in a specified wt. ratio. SOLUTION: This compsn. comprises 40-97 wt.% phenol resin and 60-3 wt.% powdery cured phenol resin having an average particle size of about 500μm or lower, pref. about 100μm or lower. Thus, a phenol resin compsn. exhibiting a low thermal conductivity at such high temps. as about 100 deg.C or higher can be obtd. without substantial detriment to mechanical strengths, such as bending strength, inherent in a cured phenol resin alone by recycling a cured phenol resin otherwise disposed of. A particulate cured phenol resin contg. an inorg. or org., fibrous or powdery filler (excludig a powdery cured phenol resin), such as glass fibers, carbon fibers, or a polytetrafluoroethylene powder, can also be used.
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