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发明名称
FLATTENING PROCESS FOR BONDED SEMICONDUCTOR SUBSTRATES
摘要
申请公布号
EP0968081(A1)
申请公布日期
2000.01.05
申请号
EP19970937023
申请日期
1997.08.06
申请人
SIBOND, L.L.C.
发明人
IYER, SUBRAMANIAN, S.;DOWNEY, WILLIAM, P.
分类号
H01L21/02;H01L21/20;H01L21/304;H01L21/66;H01L27/12;(IPC1-7):B31F1/22
主分类号
H01L21/02
代理机构
代理人
主权项
地址
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