Verfahren und Vorrichtung zum Reinigen einer Leiterplattenschablone oder einer Leiterplatte

摘要

A method and device are proposed for removing agents, in particular fluxes, adhesives or solder paste, which are adhering to a surface of a printed-circuit board mask or to a surface of a printed-circuit board in which the components may or may not have been inserted. The agents are removed by blasting at least one area of the surface of the printed-circuit board mask or of the printed-circuit board with at least one cleaning jet which contains carbon dioxide particles. The carbon dioxide particles are produced by shaving from a solid carbon dioxide body.