Method of making encapsulated electronic component with reworkable package encapsulants

摘要

A method for preparing an encapsulated electronic component using a reworkable encapsulant composition comprising a major amount of mono-functional maleimide compounds, or mono-functional vinyl compounds other than maleimide compounds, or a combination of mono-functional maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters comprising curing the composition in situ.