BGA package using a dummy ball and a repairing method thereof

摘要

In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90 DEG around the dummy balls. When a defect occurs in a solder joint, the package can be easily repaired by finding defective active ball; forming a repair hole by using a cutting means at a predetermined portion of the printed circuit board corresponding to a central position between the dummy ball and the defectively soldered active ball; inserting a solder paste injector into the repair hole to inject solder thereinto; and mutually connecting pad extensions of the dummy ball and the defective active ball with the injected solder. Therefore, the overall process can be simplified and its reliability can be improved.