发明名称 |
Metal injection molded cover for an electrochemical cell |
摘要 |
A cover for an electrochemical cell is molded by a metal injection molding process. The cover includes a main body portion completely integral with a feedthrough ferrule portion for accommodating an electrical lead to pass through the cover and/or completely integral with a fillport portion for introducing cathode material into the cell.
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申请公布号 |
US6010803(A) |
申请公布日期 |
2000.01.04 |
申请号 |
US19970902679 |
申请日期 |
1997.07.30 |
申请人 |
MEDTRONIC, INC. |
发明人 |
HELLER, JR., BERNARD F.;JAHNS, SCOTT E.;HAEG, DANIEL C. |
分类号 |
H01M2/02;H01M2/04;H01M2/06;H01M2/36;(IPC1-7):H01M2/04 |
主分类号 |
H01M2/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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