发明名称 Metal injection molded cover for an electrochemical cell
摘要 A cover for an electrochemical cell is molded by a metal injection molding process. The cover includes a main body portion completely integral with a feedthrough ferrule portion for accommodating an electrical lead to pass through the cover and/or completely integral with a fillport portion for introducing cathode material into the cell.
申请公布号 US6010803(A) 申请公布日期 2000.01.04
申请号 US19970902679 申请日期 1997.07.30
申请人 MEDTRONIC, INC. 发明人 HELLER, JR., BERNARD F.;JAHNS, SCOTT E.;HAEG, DANIEL C.
分类号 H01M2/02;H01M2/04;H01M2/06;H01M2/36;(IPC1-7):H01M2/04 主分类号 H01M2/02
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