| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost method of encapsulating an IC card by dropping method at high dimensional precision. SOLUTION: To encapsulate an IC chip 2 to be mounted on a substrate 1, a dam 4 is formed of resin around the IC chip mounted on the substrate. The dam 4 comprises a thermosetting resin, ultraviolet-curing resin, photo-curing resin or the like and is formed by a dispense coating method or the like to a height larger than the height of the IC chip. After the dam 4 is formed in this manner, the area surrounded by the dam 4 is filled with an encapsulating resin by the dropping method. Then, the top surface of the encapsulating resin is flattened by air spray from above the resin, pressing with a flat board or using the centrifugal force, to thereby adjust the height of the sealing resin. |
