| 摘要 |
<p>PROBLEM TO BE SOLVED: To make a semiconductor element to be positioned surely and quickly, by acquiring the pictures of positioning marks provided on a substrate and the images of the marks reflected in the side face of the element, and positioning the element on a substrate based on the positional relation between the element and substrate. SOLUTION: After a semiconductor element 12 is moved onto a substrate 14 by means of a supporting member 18, positioning marks provided on the surface of the substrate 14 and the images of the marks reflected in the side face of the element 12 are observed under a microscope device 22 by using a coaxial lighting illuminator 20, and the pictures of the marks and reflected images of the marks are acquired. The acquired pictures are processed by means of a picture processor 28. Then a main controller 32 calculates the positional relations between the pictures of the marks and reflected images and the element 12 is positioned on the substrate 14 based on the positional relation. Therefore, the element 12 can be surely and quickly positioned on the substrate 14.</p> |
