| 摘要 |
PROBLEM TO BE SOLVED: To enhance environmental resistance of resin sealed package. SOLUTION: Sealing resin 10 is injected into a region including a chip 11, Au wires 13, and the like, while touching the rear surface of respective terminals 12 and cured thermally. Each terminal 12 has multilayer structure including an intermediate layer, i.e., an Ni composite plating layer 200d dispersed with particles. Projections and recesses copying those appearing entirely on the upper surface of the Ni composite plating layer 200d also appear on the rear surface of the terminal 12. The sealing resin 10 meshes mechanically with the protrusions on the rear surface of the terminal 12 to enhance bonding strength between them. Similarly, bonding strength is enhanced between the Au wire 13 and the terminal 12. 200e, 200d are Ni plating layers for blocking intrusion of moisture and contaminant from voids in the Ni composite plating layer 200d. |
