发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To make the yield calculation of a bonding process and the analysis of defective modes to be carried out easily by providing an input means, etc., which inputs the defective mode of bonding parts transported in unbonded states and transporting the bonding parts by inputting the defective mode. SOLUTION: When an error occurs and bonding parts are transported in unbonded states, whether or not the setting of automatic discharge is 'ON' is first discriminated (S1). When the setting is 'OFF', an error alarm is issued (S2) and the error is remedied (S3). Then whether or not a transportation switch is 'ON' is discriminated (S4). When the transportation switch or setting of automatic discharge is 'ON', a controller discriminates whether or not bonding is completed (S7). When the bonding is not completed, whether or not the setting of the designation of defective mode input is 'ON' is discriminated (S8). When the setting of the designation is 'ON', a calling signal which makes a notification is issued (S9) and the number indicating the content of the defect is inputted from a keyboard (S10). After inputting the number, the transportation of the bonding parts is started (S11).
申请公布号 JPH11354573(A) 申请公布日期 1999.12.24
申请号 JP19980173862 申请日期 1998.06.05
申请人 KAIJO CORP 发明人 NISHIMAKI KOUJI
分类号 H01L21/60 主分类号 H01L21/60
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