| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which has an enough formed front fillet, high connection strength to substrate electrodes and high connection reliability and facilitates the appearance inspection. SOLUTION: In a semiconductor device having an outer lead 2 which extends to outside from a package 1 sealing a semiconductor chip and is connected to the semiconductor chip, at least a part of the section of the lead 2 at its top is coated with a material for improving the solderability. The manufacturing method thereof comprises, in a semiconductor device having e.g. a gull wing-like or straight outer lead 2, a recess 11 is formed at a cutting position of the outer lead 2, coating a material for improving the solderability and cutting the outer lead 2 off at the recessed part.</p> |
