| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size even of a module or a set incorporating a light emitting element and a light receiving element by making these elements as thin as possible. SOLUTION: A light emitting element and a light receiving element, i.e., semiconductor chips 23, 24, are sealed with a resin sealing body 25 composed of a material transparent to light. A groove 27 is made in a region where light is emitted from the element or light impinges on the element and a reflective face 26 is formed thereat. Consequently, the light can exit or enter through the side face E. Furthermore optical noise is suppressed by sandwiching the element between a supporting board 21 and a mounting board 30. |
