METHOD AND APPARATUS FOR BONDING ELECTRONIC DEVICE WITH BUMP

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for bonding an electronic device having bumps in which the device can be pressed against a substrate without causing any damage on a device mounted on the rear surface and can be subjected to function test under that state. SOLUTION: In an apparatus for bonding an electronic device 6 having bumps to the upper surface of a substrate 2 mounted with electronic devices 5A, 58 on the lower surface thereof by means of a bonding head, a side plate 13 for supporting the lower surface of the substrate 2 directly is provided at a lower receiving part 11 for receiving the pressing load F at the time of bonding along with a resilient body 12 for supporting the electronic devices 5A, 58 mounted on the side opposite to the electronic device 6 resiliently. Since the pressing load F is distributed, the electronic device having bumps can be bonded to the substrate without causing any damage on an already mounted electronic device.