| 摘要 |
A tungsten alloy electroplating bath. Highly ductile tungsten alloy deposits are facilitated using a sulfur co-depositing ductility additive such as: (a) or (b) or (c), wherein R1 is selected from the group consisting of H, alkyl, alkenyl, hydroxy, halogen, carboxy and carbonyl; "AR" designates a benzene or naphthalene moiety; R2 is selected from the group consisting of H, or an alkyl sulfonic acid, a Group I or Group II salt of an alkyl sulfonic acid, a benzene, a sulfonate, a naphthalene sulfonate, a benzene sulfonamide, a naphthalene sulfonamide, an ethylene alkoxy, a propylene alkoxy; and R2 may be attached to "AR" to form a cyclic moiety; and R3 is selected from the group consisting of a benzene, a naphthalene, an unsaturated aliphatic group; and a benzenesulfonate group. The additive provides ductility improvements in tungsten alloy electroplates deposited from the solution. |
