发明名称 DEVICE AND METHOD FOR ABRADING AND FLATTENING SEMI-CONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To ensure both the excellent flatness of a surface stepped part of a semi-conductor element and the uniformity of the grinding quantity in the surface of the semi-conductor element by forming a part of the first hardness or modulus of elasticity and a part of the second hardness or modulus of elasticity to be first and second parts of an abrasive pad, respectively. SOLUTION: A fan-shaped part of approximately 20% of an abrasive pad to be formed circular according to a surface plate 1 on a disk is a hard abrasive pad A, and a part corresponding to the remaining area of approximately 80% is a soft abrasive pad B. An upper layer of a first part in contact with a semi- conductor element is of approximately 95 Shore hardness in the hard abrasive pad A and the soft abrasive pad B consisting of two polyurethane materials, and a lower layer of a second part is approximately 82 Shore hardness in the abrasive pad A and of approximately 61 Shore hardness in the abrasive pad B. The excellent flatness can be obtained by selectively grinding a stepped part of the semi-conductor element, and the uniformity of the grinding quantity in the surface of the semi-conductor element even with a slight distortion in the surface plate 1.
申请公布号 JPH11347919(A) 申请公布日期 1999.12.21
申请号 JP19980160685 申请日期 1998.06.09
申请人 OKI ELECTRIC IND CO LTD 发明人 FUSHIMI KIMIHISA
分类号 B24B37/20;B24B37/22;B24B37/24;B24D7/14;H01L21/304 主分类号 B24B37/20
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