| 摘要 |
A method, apparatus and package for packaging contaminant-sensitive articles such as semi-conductor wafers on shock absorbers in a sealed rigid plastic enclosure such as a box or the like which may be enclosed within another sealed enclosure wherein the sealed enclosures are each provided with a self-sealing member together with a hollow needle connected to a source of purging gas and a vacuum source for selectively piecing one or more of the self-sealing members to communicate the gas and vacuum sources with a selected one of the enclosures interiors for purging and/or evacuating the enclosures interiors to remove ion contaminants, moisture, oxygen, plastic particles, etc. whereby corrosive activity on the articles is eliminated and the sealed condition of both enclosures is maintained after the contaminants, etc. are removed and the needle is withdrawn thereby providing increased productive yields of such articles being processed between manufacturing steps by reducing or substantially eliminating environmental variations.
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