发明名称 Cable-to-board arrangements for enhanced RF shielding
摘要 A cable-to-board arrangement configured to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. The cable-to-board arrangement includes a first nonconductive housing and a flexible board having thereon a plurality of conductive traces. The conductive traces have first ends and second ends opposite the first ends with the first ends being electrically coupled to the wires. The first nonconductive housing encapsulates a first portion of the flexible board including the first ends. The cable-to-board arrangement further includes a plurality of conductive legs configured for coupling with the surface-mounted pads on the board. The plurality of conductive legs are electrically coupled to the second ends of the conductive traces. There is also included a second nonconductive housing encapsulating a second portion of the flexible board including the second ends of the conductive traces and a portion of the conductive legs. Further, there is included an RF partition disposed proximate said flexible board for reducing RF emission from the circuit board in the direction toward the first non-conductive housing.
申请公布号 US6004145(A) 申请公布日期 1999.12.21
申请号 US19980152357 申请日期 1998.09.14
申请人 DICON (S) PTE LTD.;DICON CONNECTORS, INC.;FOCUS ENHANCEMENTS, INC. 发明人 GASPAROVIC, STEVEN PAUL;ENG, LEE HOCK;SWEE, NG LEA;CLARK, PHILIP EARLE;ANDERSON, RONALD K.;GIBBONS, ALAN SCOTT
分类号 H01R12/16;H01R13/56;H01R13/58;H01R13/658;(IPC1-7):H01R9/09 主分类号 H01R12/16
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