PRESSURE-SENSITIVE ADHESIVE SHEETS HAVING THERMAL CONDUCTIVITY

摘要

PROBLEM TO BE SOLVED: To obtain the subject sheet having excellent adhesion between a substrate and a pressure-sensitive adhesive agent composition layer and retention performances in use at a high temperature without providing an undercoating layer by using a plastic film containing a granular solid exposed to the surface as the substrate and forming a pressure-sensitive adhesive composition layer on the substrate. SOLUTION: This pressure-sensitive adhesive sheet having thermal conductivity is obtained by using a plastic film containing 2-50 vol.% of a granular body in which the granular body is exposed to the surface of the film as a substrate and forming a pressure-sensitive adhesive agent composition layer on the substrate. A polyimide (amide) is preferable as the material of the substrate. Aluminum oxide or boron nitride having 2-10μm particle diameter is preferable as the granular body. In order to expose the granular body to the surface of the substrate, the following method is adopted. Namely the granular body is added to a polymer to give a composition, which is formed into a film. The surface of the film is subjected to sputtering etching treatment. A composition comprising a (meth)acrylic acid alkyl ester-based polymer as a main agent is preferable as the pressure-sensitive adhesive agent composition.