发明名称 Wiring board constructions and methods of making same
摘要 A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped recess in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.
申请公布号 US6005198(A) 申请公布日期 1999.12.21
申请号 US19970946297 申请日期 1997.10.07
申请人 DIMENSIONAL CIRCUITS CORPORATION 发明人 GREGOIRE, GEORGE D.
分类号 H01R12/55;H05K1/09;H05K1/11;H05K3/00;H05K3/06;H05K3/10;H05K3/12;H05K3/40;H05K3/46;(IPC1-7):H01R9/09 主分类号 H01R12/55
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