Method of placing components on circuit boards

摘要

The method involves moving a positioning head holding a component so that an area of the circuit board that has been imaged is aligned with respect to the side of the component that has been imaged. The method involves aligning the contact elements (11) on the side of the component (8) facing the circuit board (9) with the corresponding contact pads (10.1-10.5) of the circuit board. At least one optical device is used to form an image of one side (12,13) of the component at an angle ( alpha ) to the plane of the board and of an area of board under the component when viewed perpendicularly to the board. A component held in a positioning head (7) is moved so that the area whose image was formed is aligned with respect to the side of the component whose image was formed. An Independent claim is also included for an arrangement for implementing the method.