发明名称 PHOTOPOLYMERIZABLE RESIN COMPOSITION AND USE THEREOF
摘要 A photopolymerizable resin composition comprising a component (A) comprising a resin and/or a resin-forming ingredient and a photopolymerization initiator (B), wherein the component (A) comprises an addition-polymerizable compound (A1) having at least two ethylenically unsaturated groups per molecule and the initiator (B) comprises a diaminobenzophenone compound (B1), an N-phenylglycine compound (B2), and at least one compound selected from the group consisting of a 3,3',4,4'-tetra(alkylperoxycarbonyl)benzophenone (B3), 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (B4), and a 1,3,5-triazine derivative (B5) substituted by at least one trihalogenomethyl group. The composition is excellent in resolution, pattern adhesion, development margin, and curability in surface and inner parts. It is hence suitable for use in applications such as an electrical insulating film, colored film, ink for color filters, resist for semiconductors, and electrical insulating spacer for touchpanels, etc.
申请公布号 WO9964471(A1) 申请公布日期 1999.12.16
申请号 WO1999JP03060 申请日期 1999.06.08
申请人 NIPPON STEEL CHEMICAL CO., LTD.;FUJISHIRO, KOICHI;HIGASHI, MANABU 发明人 FUJISHIRO, KOICHI;HIGASHI, MANABU
分类号 G03F7/028;C08F2/48;C08F2/50;C08F20/10;C08F290/06;C08K5/17;C08L57/00;C08L101/14;C09D4/02;G02B5/22;G03F7/00;G03F7/031;(IPC1-7):C08F2/48;C09D4/00;G02B5/20;G03F7/004 主分类号 G03F7/028
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