| 摘要 |
A resin-sealed semiconductor device includes a heat sink (20) on which a semiconductor chip (28) is provided. An output terminal (30) is connected to the semiconductor chip (28). A casing (22) surrounds the chip (28) and output terminals (30). Inside the casing (22), a sealing resin (32) containing an aggregate (34) such as glass particles is filled. The chip (28) is mounted in an area of an upper surface (21) of the heat sink (20) and the remaining area is covered with an epoxy resin film (40) of from 10 mu m to 20 mu m. The resin film (40) increases the bond strength between the sealing resin (32) and the heat sink (20) and prevents the occurrence of peeling of the sealing resin (32) from the heat sink (20) upon heat cycles due to difference in expansion coefficient. <IMAGE> |
