Method of manufacturing bonding wire for semiconductor device

摘要

A bonding wire for semiconductor devices is manufactured by a process which includes applying a lubricant to a wire and taking measures to ensure good adhesion between the lubricant and the wire. In particular wire may be cooled to directly after final annealing at a rate of 1000{C/sec. or more. Alternatively, the wire may be withdrawn form the lubricant solution at an angle of between 50 and 60{ to the surface of the solution. In a yet further alternative the wire is given a surface removal treatment after annealing.