发明名称 Group III-V compound semiconductor wafer
摘要 A wafer (21) consisting of a group III-V compound semiconductor comprises a substrate (22) consisting of a group III-V compound whose outer peripheral edge portion is so chamfered that its section has an arcuate shape substantially with a radius R, and an epitaxial layer (26) consisting of a group III-V compound layer formed on the substrate (22). A portion of the wafer (22) separating from its outer peripheral edge by a distance L is removed, and the distance L satisfies the relation of an expression R </= L </= 3L. <IMAGE>
申请公布号 EP0884771(A3) 申请公布日期 1999.12.15
申请号 EP19980107445 申请日期 1998.04.23
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MIURA, YOSHIKI;MORIMOTO, TOSHIYUKI
分类号 H01L21/76;H01L21/02;H01L21/20;H01L21/304;H01L21/762;H01L27/08;H01L27/12;H01L29/786 主分类号 H01L21/76
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