发明名称 |
Group III-V compound semiconductor wafer |
摘要 |
A wafer (21) consisting of a group III-V compound semiconductor comprises a substrate (22) consisting of a group III-V compound whose outer peripheral edge portion is so chamfered that its section has an arcuate shape substantially with a radius R, and an epitaxial layer (26) consisting of a group III-V compound layer formed on the substrate (22). A portion of the wafer (22) separating from its outer peripheral edge by a distance L is removed, and the distance L satisfies the relation of an expression R </= L </= 3L. <IMAGE> |
申请公布号 |
EP0884771(A3) |
申请公布日期 |
1999.12.15 |
申请号 |
EP19980107445 |
申请日期 |
1998.04.23 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
MIURA, YOSHIKI;MORIMOTO, TOSHIYUKI |
分类号 |
H01L21/76;H01L21/02;H01L21/20;H01L21/304;H01L21/762;H01L27/08;H01L27/12;H01L29/786 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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