| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture of a semiconductor device where a plurality of leads can be bonded without using solder plating process or tin plating process. SOLUTION: In the manufacture of a semiconductor device which achieves electrical continuity between a semiconductor chip and outside by a plurality of leads bonded with each another, activation treatment is performed for the junction region of each lead to be bonded, and in the condition that the surface is activated, each junction region is brought into contact with the next, and plural leads 7, 8 are bonded with each another. Especially, ion impact or radical irradiation is utilized in the activation treatment.
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