发明名称 |
Device for dissipating heat from ferrite cores of inductive components |
摘要 |
A device for dissipating heat from ferrite cores of inductive components is provided. Specifically, in order to dissipate heat from cores made from ferromagnetic material for inductive components, an electrically and thermally conductive layer which can be coupled thermally to a heat sink is provided on prescribed surface areas of the core.
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申请公布号 |
US6002318(A) |
申请公布日期 |
1999.12.14 |
申请号 |
US19970922631 |
申请日期 |
1997.09.03 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WERNER, TRISTAN;ESGUERRA, MAURICIO |
分类号 |
H01F27/08;H01F27/22;(IPC1-7):H01F27/08;H01F17/00 |
主分类号 |
H01F27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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