| 摘要 |
PROBLEM TO BE SOLVED: To obtain a connection structure for a highly reliable and simple constructed high frequency wiring substrate having small transmission loss on the signal transmission path of microwaves and millimeter waves. SOLUTION: A high frequency element 5 is mounted on one surface of the first dielectric substrate 2, the first high frequency transmission line 6, other surface of which is electrically connected to the high frequency element 5, and the second high frequency transmission line 7 are formed on the second dielectric substrate 13. The other end of the first line 6 and the end of the second line 7 are electrically connected respectively through the slot hole 9 of the ground layer 8 to be formed on the first dielectric substrate 2 or on the second dielectric substrate 13. |
