| 摘要 |
PROBLEM TO BE SOLVED: To provide a method to efficiently manufacture a IC card without increasing the facilities at the time of mass-producing an IC card. SOLUTION: This manufacturing method of an IC card comprises temporarily connecting chip parts 2 to a circuit formed on a substrate 1 through an anisotropic conductive film 3 or anisotropic conductive paste, overlaping protective layers 4 coated with an adhesive 41 on and under the substrate 1 to make the adhesive 41 inner sides, further overlaping a cushioning material 5 on the surfaces of the layers 4 and integratedly laminating them with heating and pressing. |
