| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily fit an outside ring for extending and retaining a wafer sheet to an inside ring with less force. SOLUTION: At the upper part of an extension stage 11 where a wafer being subjected to full cut dicing and a wafer sheet being applied to the wafer are placed and at the same time an inside ring is mounted to the upper part of an outer periphery in an insertable manner, a double ring holder 1 for retaining an outside ring 15 for fitting to the outer periphery of the inside ring is provided while it can move up and down. Then, in the double ring holder 1, means 2a, 3, and 4 are provided, where the means position the outside ring 15 at a position where the outside ring 15 can be fit to the inside ring while the outside ring 15 is retained.</p> |
