| 摘要 |
PROBLEM TO BE SOLVED: To enable bonding with high reliability in strength and at a low cost by bonding a copper plate at a specific temp. in an inert atmosphere with a non-oxidized ceramics substrate, while oxidized ceramics layers are dotted like an island on the bonding surface of the non-oxidized ceramics substrate. SOLUTION: Bonding is carried out at >=1000 deg.C. It is important that the diameter of oxidized ceramics layers like an island is <=2 mm and its thickness is <=30μm. As for the oxidized ceramics layer formed on the bonding surface, a mixture oxide, in which an additive of 0-20 total mass % selected from silicon oxide, magnesium oxide, calcium oxide and yttrium oxide is mixed with aluminum oxide zirconium oxide or mullite is preferably used. The oxidized ceramics powder is made paste on the surface of the non-oxidized ceramics substrate and, pref., it is printed by screen printing or a slurried solution is applied by spray coating, and after that, sintering is performed.
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