Electronic parts mounting method

摘要

An electronic parts mounting method comprises a first step of forming precoatings on electrodes of a circuit board, a second step of depressing the bumps of an electronic part having bumps eat into the electrodes by pressing the electronic part having bumps to the circuit board with a mounting unit, and interposing a bonding agent between the electronic part having bumps and the circuit board, and a third step of carrying the circuit board to a thermal compression bonding unit and pressing while heating the electronic part having bumps to the circuit board with a thermal compression bonding head. This method is capable of preventing the electronic part having bumps from being deviated during carriage and allows works to be carried out in parallel with one another at a plurality of working stages, thereby enhancing a working efficiency.