发明名称
摘要 PURPOSE: To obtain lightweight prepreg for molding an FRP product, having a low modulus of elasticity, excellent moldability and heat characteristics by impregnating an epoxy resin composition containing a polyepoxy compound and a curing agent into reinforcing fibers composed of filament carbon fibers. CONSTITUTION: This prepreg is obtained by impregnating an epoxy resin composition containing (A) a polyepoxy compound containing at least two or more epoxy groups in one molecule (e.g. bisphenol A type epoxy resin), (B) a curing agent (preferably dicyandiamide) and (C) a curing promotor into (D) reinforcing fibers composed of filament carbon fibers having 0.4-7ton/mm<2> modulus of elasticity and <=11μm average diameter.
申请公布号 JP2989506(B2) 申请公布日期 1999.12.13
申请号 JP19950026992 申请日期 1995.02.15
申请人 SHINNITSUTETSU KAGAKU KK;SHINNIPPON SEITETSU KK 发明人 ITO SAKANORI;NAKANISHI TOMOHIRO;MAKI MIKITO
分类号 B29B11/16;B29B15/10;B29K63/00;B29K105/08;B29K307/04;C08J5/04;C08J5/24;(IPC1-7):C08J5/24 主分类号 B29B11/16
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